Aluminum Silicon Carbide (AlSiC)

Lightweight Strength for Thermal Management

Aluminum Silicon Carbide (AlSiC) is an advanced metal matrix composite combining the lightweight, high thermal conductivity of aluminum with the exceptional stiffness and low thermal expansion of silicon carbide. This unique combination delivers superior mechanical stability, excellent heat dissipation, and a close match to semiconductor device materials — making AlSiC an ideal choice for high-performance electronic packaging and structural applications.

Specifications

  • Matrix Material: Aluminum alloy (6061, 7075, or custom)

  • Reinforcement Material: Silicon Carbide (SiC) particles (monocrystalline or polycrystalline)

  • SiC Volume Fraction: 25–70% (customizable for thermal and mechanical properties)

  • Thermal Conductivity: 170–230 W/m·K (matches silicon chips for thermal management)

  • Coefficient of Thermal Expansion (CTE): 6–10 ppm/K (tailored to minimize thermal stress)

  • Density: 2.7–3.0 g/cm³ (lightweight, near aluminum)

  • Tensile Strength: 300–500 MPa (2x unreinforced aluminum)

  • Operating Temperature: -40°C to 400°C (robust for high-temperature environments)

  • Young’s Modulus: 100–150 GPa (high stiffness for structural applications)

  • Fabrication Methods: Stir casting, powder metallurgy, liquid metal infiltration

  • Surface Finish: Machined, polished, or net-shape (no finish machining required)

  • Certifications: ISO 9001, ISO 14001, RoHS, REACH

  • Packaging: Anti-static, vacuum-sealed in Class 100 cleanroom for reliability

Contact Us: Inquire about custom specifications or pricing. Click below to connect with our team.

Standout Features

  • High Thermal Conductivity – Efficient heat removal for high-power devices.

  • Low Coefficient of Thermal Expansion (CTE) – Matches semiconductors like Si, SiC, and GaAs to minimize stress.

  • Lightweight Strength – High stiffness-to-weight ratio for structural reliability.

  • Corrosion Resistance – Durable in harsh environments.

  • Design Flexibility – Net-shape castable into complex geometries.

  • Excellent Mechanical Stability – Maintains dimensional accuracy under thermal cycling.

Applications

  • Electronic Packaging – Heat spreaders, lids, and baseplates for high-power semiconductors.

  • RF & Microwave Modules – Housings for high-frequency and satellite components.

  • Aerospace Structures – Lightweight panels and thermal control components.

  • Automotive Electronics – Power control units, inverters, and sensor modules.

  • Defense Systems – Radar, guidance systems, and rugged electronics packaging.

Superior Benefits

  • Reduced Thermal Stress – CTE match minimizes cracking and delamination.

  • Weight Savings – Lighter than copper while maintaining strength.

  • Enhanced Device Reliability – Protects components from heat and mechanical strain.

  • Customizable – Shape, composition, and properties tailored to application needs.

  • Long Service Life – Resists corrosion, fatigue, and thermal cycling degradation.

AlSiC vs. Traditional Materials

  • Thermal Conductivity: 170–230 W/m·K (vs. aluminum’s 150–200 W/m·K, copper’s 400 W/m·K) balances heat dissipation and weight.

  • Lower CTE: 6–10 ppm/K (vs. aluminum’s 23 ppm/K, copper’s 17 ppm/K) minimizes thermal stress in electronics.

  • Lightweight: 2.7–3.0 g/cm³ (vs. copper’s 8.9 g/cm³) reduces weight by 60% in aerospace and EV applications.

  • Higher Strength: 300–500 MPa tensile strength (vs. aluminum’s 200–300 MPa) enhances durability.

  • Cost Efficiency: Net-shape fabrication reduces processing costs vs. copper-molybdenum (CuMo) or copper-tungsten (CuW) alloys.

Why Choose Us?

Our AlSiC MMCs lead in a competitive market, powered by Singapore’s market agility and Taiwan’s world-class semiconductor expertise. Here’s why global buyers trust us:

  • Uncompromising Quality: Partnering with Taiwanese foundries, we deliver ISO 9001-certified AlSiC MMCs with tailored SiC content (25–70%), meeting aerospace and semiconductor standards.

  • Advanced Manufacturing: Stir casting and powder metallurgy with 8-inch wafer compatibility match CPS Technologies’ precision, improving yield by 5–10%.

  • Reliable Supply Chain: Our Singapore-Taiwan synergy mitigates SiC supply risks, ensuring stability akin to Denka’s global partnerships.

  • Cost Optimization: Net-shape fabrication and high-volume production reduce costs by up to 20%, addressing buyer concerns about MMC pricing.

  • Custom Solutions: Tailored SiC volume fractions and CTE (6–10 ppm/K) meet specific project needs, mirroring Materion’s application-specific approach.

  • Sustainability Focus: Lightweight AlSiC reduce energy consumption in EVs and renewables by 10–15%, supporting green initiatives.

  • Global Trust: Certified to ISO 9001, ISO 14001, RoHS, and REACH, our MMCs are trusted by OEMs in 50+ countries, backed by Taiwan’s 46% foundry share.

Contact Us: Ready to enhance your systems with our AlSiC MMCs? Click below to request a quote or discuss custom specifications.

Industries Served

  • Semiconductor Packaging

  • Telecommunications

  • Aerospace & Defense

  • Automotive & Electric Vehicles

  • Industrial Power Systems

  • Renewable Energy

Why Choose AlSiC?

  • Superior Thermal Management: 170–230 W/m·K conductivity ensures reliable heat dissipation in power electronics.

  • Lightweight Strength: 2.7–3.0 g/cm³ density and 300–500 MPa strength optimize aerospace and EV performance.

  • Low Thermal Expansion: 6–10 ppm/K CTE minimizes stress in semiconductor packaging.

  • Cost-Effective Production: Net-shape fabrication reduces costs by 20%, ideal for high-volume applications.

  • Market Leadership: Aligned with the $413.42 million AlSiC MMC market’s 7.3% CAGR, driving innovation.