Advanced Packaging and OSAT Training
Overview
Our Advanced Packaging and OSAT (Outsourced Semiconductor Assembly and Test) Training, in collaboration with Taiwan’s Industrial Technology Research Institute (ITRI) and ASE, trains engineers in 3D packaging, chiplet integration, and testing for automotive and AI chips. This program addresses the global shortage of OSAT experts.
Why Choose Us
Taiwan’s 90% share of advanced packaging makes our program unmatched. We leverage ASE’s expertise to train engineers for the industry’s $174 billion output in 2024.
Contact Us
Want to lead in OSAT? Click below to request a quote for our training program.
What We Offer
Packaging Technologies: Learn 2.5D/3D packaging, chip-on-wafer-on-substrate (CoWoS), and fan-out wafer-level packaging.
Testing Protocols: Master HTOL, HAST, and wafer probing for AEC-Q100 compliance.
Hands-On Labs: Train in ITRI’s advanced packaging facilities, replicating ASE’s production environment.
Certification: Earn a globally recognized certificate from ITRI, endorsed by ASE, validating OSAT expertise.
Benefits
Master advanced packaging for chiplets and AI.
Ensure compliance with automotive standards.
Gain hands-on experience in Taiwan’s facilities.
Earn a globally respected certification.
