Authorised distributor of Taiwanese compound and power semiconductors — SiC, GaN, GaAs and InP wafers, power devices and thermal materials — for AI data centres, electric vehicles, renewable energy and 5G/RF. Singapore-based since 2015.

Singapore’s commercial agility and Taiwan’s manufacturing depth in one supply chain. As an authorised distributor for premier Taiwanese manufacturers, Supreme Pro gives customers direct access to high-yield substrates and devices, with engineering support and logistics handled from Singapore.

Leveraging Taiwan’s engineering prowess, we deliver tailored solutions that enhance yield, accelerate time-to-market, and ensure reliability. Trust our expertise to streamline processes and empower your team, positioning your projects for success in a competitive market.

Our SiC, GaN, GaAs, and InP Wafers deliver high electron mobility (up to 8500 cm²/V·s) and direct bandgaps for 5G, optoelectronics, and aerospace. With low-defect epitaxy and scalable 6–8-inch substrates, we empower high-frequency, high-efficiency devices.

Our SiC MOSFETs, SiC Diodes, and GaN HEMTs deliver >98% efficiency and high-frequency operation for EVs and renewable energy. With low on-resistance and thermal resilience, these devices enable compact, reliable designs. Choose us for automotive-grade solutions that meet stringent JEDEC standards and power your innovations.

Our Aluminum Silicon Carbide metal matrix composites provide lightweight strength and superior thermal management for semiconductors and aerospace. Tailored SiC content ensures durability and cost efficiency. Partner with us to optimize high-power electronics and structural components with industry-leading reliability.

Our Thermal Interface Materials (TIMs) enable efficient heat dissipation for high-performance electronics. With excellent compressibility and robust insulation, our TIMs ensure reliability in compact devices. Partner with us to enhance thermal performance in consumer electronics, 5G, and data centers, driving efficiency and longevity.

Through our Taiwanese manufacturing partners we arrange back-end wafer probing, assembly, final test and advanced packaging for the devices we supply, delivered in ISO 9001-certified partner facilities — one point of contact in Singapore, production-grade capacity in Taiwan.

Our partners’ Industry 4.0-driven smart manufacturing leverages AI and IoT for real-time process optimization. With high-throughput, low-defect production, we ensure cost-efficient, scalable semiconductor solutions. Partner with us to achieve unparalleled yield and agility, meeting the demands of next-generation electronics markets.