Semiconductor Innovation: Powering the Future

Our comprehensive portfolio of semiconductor solutions, from front-end substrates to back-end manufacturing equipment, drives performance across 5G, EVs, data centers optoelectronics, and smart industries. Leveraging Singapore’s market agility and Taiwan’s 46% global foundry expertise, we deliver high-quality, scalable products that enhance efficiency, reliability, and innovation for your cutting-edge applications.

SiC Wafers

High-Performance Substrates for Power Electronics
Our Silicon Carbide (SiC) wafers (150–200mm, 4H/6H) offer wide bandgap (3.26 eV) and high thermal conductivity (370 W/m·K), enabling efficient power conversion in EVs, solar inverters, and industrial drives. With low-defect epitaxy, they ensure high-yield, reliable devices for next-generation energy systems.

SiC MOSFETs

High-Efficiency Power Switching
Our SiC MOSFETs (650V–1200V) deliver >98% efficiency and low on-resistance (20–80 mΩ) for EV traction inverters, solar converters, and industrial motors. With high thermal stability (up to 200°C), they enable compact, reliable power electronics for energy-efficient systems.

ATIMs

Advanced Thermal Interface Solutions
Our Advanced Thermal Interface Materials (5–10 W/m·K) provide superior heat dissipation for CPUs, EV batteries, and 5G modules. With high compressibility and insulation (>10 kV/mm), they ensure reliability in compact, high-power electronics.

Rapid Thermal Process (RTP) Machines

High-Speed Annealing Solutions
Our RTP and RTA machines, with laser and machine vision applications, provide precise, rapid annealing for SiC, GaN, and silicon wafers. They enhance doping activation and defect repair in LEDs, power devices, and MEMS.

GaN Wafers

High-Frequency Substrates for Advanced RF and LEDs
Our Gallium Nitride (GaN) wafers (50–150mm) deliver high electron mobility (2000 cm²/V·s) for 5G RF modules, LEDs, and power electronics. Available as templates on sapphire or SiC, they enable compact, high-efficiency devices for telecommunications and automotive applications.

SiC Diodes

Robust Power Rectification
Our SiC Diodes (600–1700V) offer low forward voltage and high surge capability for EV chargers, renewable energy systems, and power supplies. Their high-temperature operation (200°C) ensures durability and efficiency in demanding applications.

Testing, Assembly & Packaging Machines

Precision Back-end Solutions
Our advanced machines, including inductor process equipment, laser marking, and aging testers, deliver high-throughput testing and packaging for ICs. Optimized for 5G, automotive, and consumer electronics, they ensure defect-free, scalable production.

Advanced Industrial & Smart Card Adhesives

Reliable Bonding Solutions
Our high-performance adhesives offer thermal stability and strong adhesion for smart cards, automotive sensors, and industrial electronics. With low outgassing and RoHS compliance, they ensure durability in IoT and consumer applications.

GaAs Wafers

Precision Substrates for Optoelectronics and RF
Our Gallium Arsenide (GaAs) wafers (100–150mm) provide direct bandgap (1.43 eV) for high-speed photodetectors, lasers, and 5G RF devices. With low-defect epitaxy, they ensure superior performance in fiber optics, satellite communications, and consumer electronics.

GaN HEMTs

High-Frequency Power Transistors
Our GaN High Electron Mobility Transistors (HEMTs, 100–650V) provide high switching speeds (up to 2 MHz) for 5G base stations, EV OBCs, and compact chargers. With low gate charge, they enhance efficiency in RF and power applications.

Smart Manufacturing Products

Digital Factory Optimization
Our smart manufacturing solutions, including factory digital management and data analytics, leverage AI and IoT for real-time process control. They enhance yield and efficiency in wafer fabrication and assembly for 5G and IoT applications.

InP Wafers

High-Speed Substrates for Optical Communications
Our Indium Phosphide (InP) wafers (100–150mm) offer high electron mobility (5400 cm²/V·s) for photodetectors, lasers, and PICs in AI-driven datacom and telecom. Their low-noise performance ensures reliable, high-speed optical systems for 5G and data centers.

AlSiC

Lightweight Thermal Management
Our AlSiC Metal Matrix Composites (170–230 W/m·K, 6–10 ppm/K CTE) offer lightweight strength for semiconductor packaging, EV battery modules, and aerospace components. Tailored SiC content ensures thermal stability and cost efficiency.

Flexible Printed Circuits (FPCs) Equipment

High-Precision Circuit Fabrication
Our FPC equipment, including electroplating and vacuum fast press, enables high-density, flexible circuits for wearables, medical devices, and automotive displays. With advanced surface treatment, they ensure reliability and miniaturization.